Qualcomm purchased the system-on-a-chip engineering assets from WiMAX chipset vendor TeleCIS Wireless for an undisclosed amount, giving Qualcomm an entry into the mobile WiMAX market if it so chooses. The CDMA champion said the purchase will bolster its expertise in OFDMA technology, which promises to be the basis for a number of technologies, including the migration road map for CDMA 1xEV-DO and HSDPA. Qualcomm, which has yet to support WiMAX, said it may enter the market if it sees a business case and demand for products. It has been busy heavily promoting Ultra Mobile Broadband, the OFDMA road map for 1xEV-DO and Long Term Evolution, the road map for HSDPA, but Qualcomm executives said they will build a dual-mode 3G-WiMAX chipset if its customers adopt the technology. The SoC design from TeleCIS gives it a platform to launch multi-mode chips.
For more about Qualcomm's SoC assets from TeleCIS:
- read this article [1] from Telephony
Links:
[1] http://telephonyonline.com/wimax/finance/qualcomm_telecis_assets_041307/