Qualcomm outlines plans for multimode 3G/LTE chipset

During this week's Mobile World Congress in Barcelona, Qualcomm outlined plans for a multimode 3G/LTE chipset that will include support for EV-DO Rev. B and multicarrier HSPA+ and LTE. The integrated solution, which is expected to sample in mid-2010, will also feature Simultaneous Voice-Data Operation.

"Multimode 3G/LTE chipsets will be crucial to smooth deployments of LTE by operators who are looking to complement their existing 3G networks, and the MSM8960 delivers maximum flexibility," said Steve Mollenkopf, executive VP of Qualcomm.

In December, Qualcomm issued an aggressive timeline for releasing engineering samples of its LTE/HSPA+ device modem. It is trying for the second quarter of 2009.

For more:
- see InformationWeek

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